Xscend's integrated semiconductor solutions deliver the high-bandwidth camera links, precision motor control, and real-time sensing that advanced drone platforms demand.
Modern commercial and defense drones carry increasingly sophisticated sensor payloads. Multi-spectral cameras, lidar arrays, thermal imagers, and high-resolution video systems generate massive data streams that must be processed and transmitted in real time. The onboard electronics must handle this data deluge while maintaining the strict weight, power, and reliability constraints that aerial platforms impose.
Traditional drone architectures rely on multiple discrete chips for camera connectivity, flight control processing, motor drive, and power management. This approach creates bulky, power-hungry electronics stacks that consume precious payload capacity and limit flight endurance. As drones evolve from simple aerial cameras into autonomous inspection platforms, delivery vehicles, and defense assets, a fundamentally different silicon architecture is required.
Every gram matters in aerial systems. Xscend's integrated approach consolidates what traditionally required dozens of discrete components into single-chip solutions. This integration reduces PCB area by up to 60%, cuts wiring weight, lowers power consumption, and improves overall system reliability by eliminating hundreds of solder joints and interconnects.
For camera connectivity specifically, Xscend's MIPI A-PHY SerDes technology enables high-bandwidth video links over lightweight twisted-pair wiring, replacing heavy coaxial cables. The result is a dramatically lighter, more reliable connectivity backbone that can support 4K and even 8K video streams from multiple cameras simultaneously.
Advanced drone platforms present unique engineering challenges that demand purpose-built semiconductor solutions.
Multi-camera payloads generating 4K/8K streams demand sustained data throughput of 8 Gbps or more with zero frame drops over long cable runs within the airframe.
Flight controllers require sub-microsecond motor response for stable hover, aggressive maneuvers, and autonomous obstacle avoidance in gusty or GPS-denied environments.
Every gram of electronics reduces payload or flight time. Drone silicon must deliver maximum performance within the tightest possible power envelope to extend endurance.
Purpose-built silicon that addresses every critical subsystem in advanced drone architectures.
Xscend's SerDes ICs deliver 8 Gbps camera connectivity over low-cost, lightweight twisted-pair wiring. Replace heavy coaxial cables with thin, flexible links that reduce harness weight by up to 80% while supporting multiple simultaneous 4K video streams, embedded metadata, and bidirectional control channels.
A single-chip solution combining ARM processor cores, gate drivers, PMIC, and sensor interfaces for brushless motor control. Achieves sub-microsecond control loop latency with 60% smaller board footprint compared to discrete implementations, enabling compact, efficient ESC designs.
High-fidelity analog front-ends for IMU, barometric, magnetometer, and current sensing. Xscend's sensor ICs deliver industry-leading accuracy with integrated signal conditioning, digital filtering, and calibration, providing the precise environmental data that autonomous flight algorithms demand.
Multi-rail power management ICs optimized for battery-powered aerial systems. Intelligent load management, dynamic voltage scaling, and ultra-low quiescent current maximize flight endurance while maintaining stable power delivery across the full battery discharge curve.
Discover how Xscend's integrated silicon solutions can reduce weight, improve performance, and accelerate your drone development timeline.
