Xscend's advanced single-chip solutions empower automakers to build smarter, more efficient, and future-proof vehicles with integrated motor control, high-speed connectivity, and intelligent power management.
The automotive industry is undergoing its most profound transformation in over a century. Vehicles are evolving from mechanical platforms with basic electronics into software-defined machines packed with hundreds of sensors, dozens of electric motors, and high-speed data networks. Electric powertrains, advanced driver assistance systems (ADAS), and autonomous driving capabilities demand a fundamentally new semiconductor architecture.
Modern vehicles contain over 3,000 semiconductors, and that number continues to grow. Each new generation of ADAS adds more cameras, radar modules, and lidar sensors that must be connected through high-bandwidth, low-latency data links. Meanwhile, the shift to 48V mild-hybrid and full-electric architectures requires new power electronics that can handle higher voltages with greater efficiency and smaller footprint.
Xscend's integrated mixed-signal platform consolidates motor control processing, power management, gate drivers, and communication interfaces into single-chip solutions purpose-built for automotive environments. This integration eliminates dozens of discrete components, reducing board area by up to 60% while improving reliability through fewer solder joints and interconnects.
Our MIPI A-PHY SerDes technology delivers 8 Gbps camera and sensor connectivity over low-cost, lightweight twisted-pair wiring, replacing bulky coaxial cable harnesses that add weight and assembly complexity. Combined with automotive-grade qualification, functional safety compliance, and operating temperature ranges from -40°C to +150°C, Xscend silicon is engineered from the ground up for the most demanding automotive applications.
Next-generation vehicles demand semiconductor solutions that balance performance, reliability, and cost across multiple mission-critical subsystems.
Level 2+ and Level 3 autonomous systems deploy 8 to 12 cameras, plus radar and lidar modules, generating aggregate data rates exceeding 40 Gbps. These streams must reach centralized compute platforms with deterministic latency and zero data loss across cable runs of 15 meters or more.
The transition from 12V to 48V mild-hybrid architectures introduces new power management challenges. Active suspension, electric turbochargers, and high-power seat actuators require efficient DC-DC conversion, precise motor control, and robust fault protection at higher voltage levels.
Automotive electronics must meet ISO 26262 functional safety standards up to ASIL-D. Every safety-critical function requires redundant sensing, diagnostic coverage, and fail-safe operation modes, demanding silicon architectures with built-in safety mechanisms from the transistor level up.
Purpose-built silicon addressing every critical subsystem in next-generation vehicle architectures.
Xscend's automotive-qualified SerDes ICs deliver 8 Gbps camera and sensor connectivity over low-cost twisted-pair wiring. Each link supports simultaneous video, embedded data, and bidirectional control channels with built-in error correction and link integrity monitoring. Replace heavy coaxial cables with thin, flexible wiring harnesses that reduce vehicle weight and simplify assembly.
Single-chip solutions combining ARM processor cores, precision gate drivers, integrated PMIC, and sensor interfaces for brushless motor control. Ideal for EPS (electric power steering), active suspension, thermal management pumps, and seat actuators. AEC-Q100 qualified with functional safety features supporting ASIL-B and ASIL-D applications.
Isolated gate drivers supporting up to 1700V for traction inverters, onboard chargers, and DC-DC converters. Xscend's gate drivers deliver industry-leading propagation delay matching, high CMTI immunity, and integrated protection features including desaturation detection, miller clamp, and soft shutdown for safe operation of SiC and IGBT power switches.
Multi-rail power management ICs designed for the harsh automotive environment. Support the full range of vehicle power architectures from 12V to 48V with high-efficiency DC-DC converters, low-dropout regulators, and intelligent power sequencing. Built-in diagnostics and watchdog timers ensure reliable operation across the full -40°C to +150°C temperature range.
High-accuracy analog front-ends for current sensing, position detection, temperature monitoring, and pressure measurement across the vehicle. Deliver industry-leading accuracy with integrated signal conditioning, calibration, and digital output interfaces for seamless connection to domain controllers and zonal architectures.
High-speed Automotive Ethernet solutions bridging legacy CAN/LIN networks to next-generation zonal architectures. Enables seamless migration from distributed ECU topologies to centralized compute platforms while maintaining backward compatibility with existing vehicle subsystems and diagnostic tools.
Discover how Xscend's integrated silicon platform can reduce BOM cost, improve reliability, and bring your next-generation vehicle to market faster.
